• (주)테크라인코리아

  • 경기 용인시 기흥구 중부대로 184 (영덕동, 힉스유타워 지식산업센터) A동 813호
  • 대표 : 김태수
  • TEL : 070-7778-5814
  • EMAIL : tskim@tekline.co.kr
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분석 서비스

표면 분석 (성분 분석)

부품의 성분 분석을 위한 최적화된 다양한 분석 서비스를 제공합니다.

 

 

Secondary Ion Mass Spectrometry (SIMS)

X-ray Photoelectron Spectroscopy (XPS)/ Electron Spectroscopy of Chemical Analysis

High Resolution X-ray Diffraction (HRXRD)

Field-Emission Auger Electron Microscope (FE-AES)

Scanning Capacitance Microscope (SCM)

Spreading Resistance Probe (SRP)

Fourier Transform-Infrared (FTIR) Spectrometer

Atomic Force Microscope (AFM)
Surface Morphology (α-step)
Thin Film Analyzer

 

 

Front side SIMS result : Copper is found in silicon substrate due to an artifact of metal migration caused by incident ion sputtering of SIMS.

Backside SIMS result : Backside SIMS measurement reflects the true result of copper dose and does not diffuse through barrier layer.

 

 

XPS : (a) Adhesion failure issue  (b)Identification of photo resist residue

 

 

HRXRD : (a) Thickness and composition analysis for a GaN epixaxial film  (b) RSM analysis of a GaN epitaxial film

 

 

FE-AES : (a) Depth profile of a Al pad (b) AES of a Al pad

 

 

Scanning capacitance microscope : (a) Cross-section dopant distribution on a SRAM sample (b) Dopant distribution on a CIS array

 

 

AFM : (a) Surface roughness analysis  (b) 3D image

 

 

Surface morphology (α-step) : 1D surface roughness analysis

 

 

Thin Film Analyzer : Single thin film thickness measurement, SiO2: 316.38 nm