• (주)테크라인코리아

  • 경기 용인시 기흥구 중부대로 184 (영덕동, 힉스유타워 지식산업센터) A동 813호
  • 대표 : 김태수
  • TEL : 070-7778-5814
  • EMAIL : tskim@tekline.co.kr
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분석 서비스

불량 분석

반도체 및 부품의 고장분석은 제품 개발 및 양산 시 발생하는 고장의 원인 파악 및 개선에 필수 요소로서, 다양한 고장 분석 방법을 통해 최적의 분석 솔루션을 제공합니다

 

 

Destructive Analysis (파괴 분석)

- Decap and Delayer by Chemical

- Decap and Delayer by Laser

- Decap and Delayer by Parallel Lapping

 

 

Chemical Decap and Laser Decap

 

OM Image after Delayer

 

SEM Image after Delayer

 

 

Non-Destructive Analysis (비파괴 분석)

- X-Ray

- Scanning Acoustic Through (SAT)

- Optical Profiler (OP)

- 3D X-Ray Microscopy

- High-Resolution 3D Optical Microscopy

- Time Domain Reflectometry (TDR)

 

 

X-Ray (2D and Tilt)

 

Optical microscopy (OM)

 

SAT Anylysis

 

Optical profiler (OP)

 

3D X-ray microscopy ; Cu Wire

 

3D X-ray microscopy ; Al Wire

 

3D X-ray microscopy ; (a)PCB substrat  (b) TSV void

 

3D X-ray microscopy ; (a)Mini motor  (b) Wire lifting

 

 

 

High-resolution 3D optical microscopy ; Wire Bonding and Gold Bump

 

High-resolution 3D optical microscopy ; WLCSP

 

 

Electrical Analysis (전기적 분석)

- Emission Microscopy (EMMI)

- InGaAs

- Optical Beam Induced Resistance Change (OBIRCH)

- Conductive Atomic Force Microscopy & Electric Field Microscopy

- Thermal Emission Microscopy

- Nano Probing

 

 

Emission microscopy (EMMI)

 

InGaAs

 

Optical Beam Induced Resistance Change (OBIRCH)

 

Thermal emission analysis image through IC’s front side