대량 양산을 위한 다양한 종류의 패키지를 제공합니다.
양산용 패키지로 MPW 및 Engineering Sample 조립 서비스를 제공합니다.
PKG Type | Body Size | Pin Count | Photo |
---|---|---|---|
TO | TO-92 | 3/4L |
|
TO-220 | 3L | ||
TO-251 | 3L | ||
TO-252 | 3/5L | ||
SOT | SOT-23 | 3/5/6/8L |
|
TSOT-23 | 3/5/6/8L | ||
SOT-89 | 3L | ||
SOT-223 | 3L | ||
P-DIP | 300mil | 7~20L |
|
600mil | 24~48L | ||
Skinny | 22~28L | ||
Shrink | 24~42L | ||
SOP | 150~450mil | 7~32L |
|
SSOP | 150~300mil | 16~6L | |
TSOP | 8x18.4~12x18.4mm | 32~48L | |
TSSOP | 173~240mil | 8~64L | |
MSOP | 118mil | 8/10L | |
SOJ | 300~400mil | 20~44L | |
PLCC |
11.43x13.97 ~16.54x16.54mm |
32~44L |
|
QFP | 10x10 ~ 28x28mm | 44~208L |
|
LQFP | 7x7 ~ 28x28mm | 32~256L | |
TQFP | 7x7 ~ 14x14mm | 32~128L | |
QFN | 1.6x1.6 ~ 12x12mm | 12~100L |
|
DFN | 1.0x1.0 ~ 6x8mm | 4~14L | |
Ultra Slim QFN/DFN (0.35mm) | 1.1x0.7 ~ 1.6x1.6mm | 6~18L | |
Wettable Flank QFN | Available for all QFN and DFN | 12~100L |
|
PKG Type | PKG Application | Photo |
---|---|---|
DR-QFN | Available to expand pin count of QFN |
|
FlipChip | FC-QFN, FC-BGA, FC-LGA, FC-TSOT |
|
BGA | LFBGA, TBGA, TFBGA, VFBGA, WFBGA, UFBGA |
|
LGA | LGA, FlipClip LGA, SiP-LGA |
|
SiP |
SiP in LeadFrame,
SiP in BGA, SiP in LGA |
|
WLCSP | 200/300mm Wafer, Bumping, RDL, Back-End |
|
Bumping | FlipChip CSP, FlipChip BGA, QFN, DFN |
|
MCP | 4Die Stack + @, FOW, WireBond + FlipChip |
|
MIS | FlipChip MIS, WireBond MIS |
|
FanOut-WLP | M-Series FO-WLP |
|