대량 양산을 위한 다양한 종류의 패키지를 제공합니다.
양산용 패키지로 MPW 및 Engineering Sample 조립 서비스를 제공합니다.
| PKG Type | Body Size | Pin Count | Photo |
|---|---|---|---|
| TO | TO-92 | 3/4L |
    |
| TO-220 | 3L | ||
| TO-251 | 3L | ||
| TO-252 | 3/5L | ||
| SOT | SOT-23 | 3/5/6/8L |
    |
| TSOT-23 | 3/5/6/8L | ||
| SOT-89 | 3L | ||
| SOT-223 | 3L | ||
| P-DIP | 300mil | 7~20L |
  |
| 600mil | 24~48L | ||
| Skinny | 22~28L | ||
| Shrink | 24~42L | ||
| SOP | 150~450mil | 7~32L |
   |
| SSOP | 150~300mil | 16~6L | |
| TSOP | 8x18.4~12x18.4mm | 32~48L | |
| TSSOP | 173~240mil | 8~64L | |
| MSOP | 118mil | 8/10L | |
| SOJ | 300~400mil | 20~44L | |
| PLCC |
11.43x13.97 ~16.54x16.54mm |
32~44L |
 |
| QFP | 10x10 ~ 28x28mm | 44~208L |
  |
| LQFP | 7x7 ~ 28x28mm | 32~256L | |
| TQFP | 7x7 ~ 14x14mm | 32~128L | |
| QFN | 1.6x1.6 ~ 12x12mm | 12~100L |
   |
| DFN | 1.0x1.0 ~ 6x8mm | 4~14L | |
| Ultra Slim QFN/DFN (0.35mm) | 1.1x0.7 ~ 1.6x1.6mm | 6~18L | |
| Wettable Flank QFN | Available for all QFN and DFN | 12~100L |
 |
| PKG Type | PKG Application | Photo |
|---|---|---|
| DR-QFN | Available to expand pin count of QFN |
 |
| FlipChip | FC-QFN, FC-BGA, FC-LGA, FC-TSOT |
 |
| BGA | LFBGA, TBGA, TFBGA, VFBGA, WFBGA, UFBGA |
 |
| LGA | LGA, FlipClip LGA, SiP-LGA |
 |
| SiP |
SiP in LeadFrame,
SiP in BGA, SiP in LGA |
 |
| WLCSP | 200/300mm Wafer, Bumping, RDL, Back-End |
 |
| Bumping | FlipChip CSP, FlipChip BGA, QFN, DFN |
Cu/Ni/Au and Cu RDL 
Cu Pillar Bump 
Lead Free Bump |
| MCP | 4Die Stack + @, FOW, WireBond + FlipChip |
 |
| MIS | FlipChip MIS, WireBond MIS |
  |
| FanOut-WLP | M-Series FO-WLP |
 |