반도체 및 부품의 고장분석은 제품 개발 및 양산 시 발생하는 고장의 원인 파악 및 개선에 필수 요소로서, 다양한 고장 분석 방법을 통해 최적의 분석 솔루션을 제공합니다.

▶ 분석 문의/의뢰 : cs@techline.co.kr

 

 

Destructive Analysis (파괴 분석)

Decap and Delayer by Chemical

Decap and Delayer by Laser

Decap and Delayer by Parallel Lapping

 

 

Chemical Decap and Laser Decap

 

OM Image after Delayer

 

SEM Image after Delayer

 

 

Non-Destructive Analysis (비파괴 분석)

X-Ray

Scanning Acoustic Through (SAT)

Optical Profiler (OP)

3D X-Ray Microscopy

High-Resolution 3D Optical Microscopy

Time Domain Reflectometry (TDR)

 

 

X-Ray (2D and Tilt)

 

Optical microscopy (OM)

 

SAT Anylysis

 

Optical profiler (OP)

 

3D X-ray microscopy ; Cu Wire

 

3D X-ray microscopy ; Al Wire

 

3D X-ray microscopy ; (a)PCB substrat  (b) TSV void

 

3D X-ray microscopy ; (a)Mini motor  (b) Wire lifting

 

 

 

High-resolution 3D optical microscopy ; Wire Bonding and Gold Bump

 

High-resolution 3D optical microscopy ; WLCSP

 

 

Electrical Analysis (전기적 분석)

- Emission Microscopy (EMMI)

- InGaAs

- Optical Beam Induced Resistance Change (OBIRCH)

- Conductive Atomic Force Microscopy & Electric Field Microscopy

- Thermal Emission Microscopy

- Nano Probing

 

 

Emission microscopy (EMMI)

 

InGaAs

 

Optical Beam Induced Resistance Change (OBIRCH)

 

Thermal emission analysis image through IC’s front side