SOP, QFN, QFP 등 다양한 종류의 Open Cavity Package 조립 서비스를 제공 합니다.
Open Cavity Package를 이용하면 패키지 샘플 조립 시간을 획기적으로 줄여(약 1주일) 설계 검증 기간을 대폭을 단축할 수 있습니다.
팹리스는 물론 칩설계 전문업체, 연구기관, 대학 등 다양한 분야에서 Open Cavity Package를 적용할 수 있습니다.

SOP

Type Lead count Body size Lead pitch
(Lead width)
Paddle size
SOP 8 150mil 1.27mm(0.4) 2.5mm × 1.9mm
16 150mil 3.0mm × 1.9mm
20 300mil 5.5mm × 3.8mm
24 300mil 5.5mm × 3.8mm
28 300mil 5.8mm × 4.0mm

QFN

Type Lead count Body size Lead pitch
(Lead width)
Paddle size
QFN 16 3mm × 3mm 0.5mm(0.23) 1.4mm × 1.4mm
20 4mm × 4mm 0.5mm(0.3) 3.4mm × 3.4mm
20 5mm × 5mm 0.65mm(0.3) 3.4mm × 3.4mm
24 4mm × 4mm 0.5mm(0.23) 3.6mm × 3.6mm
32 5mm × 5mm 0.5mm(0.23) 3.4mm × 3.4mm
40 6mm × 6mm 0.5mm(0.25) 4.3mm × 4.3mm
48 6mm × 6mm 0.4mm(0.2) 4.3mm × 4.3mm
48 7mm × 7mm 0.5mm(0.23) 5.3mm × 5.3mm
64 9mm × 9mm 0.5mm(0.25) 7.1mm × 7.1mm
100 12mm × 12mm 0.4mm(0.2) 9.3mm × 9.3mm

PLCC/LQFP/Ceramic

Type Lead count Body size Lead pitch
(Lead width)
Paddle size
PLCC 80 12mm × 12mm 0.5mm(0.25) 8mm × 8mm
120 20mm × 20mm 0.6mm(0.33) 8mm × 8mm
LQFP 44 10mm × 10mm 0.8mm(0.44) 6.8mm × 6.8mm
64 10mm × 10mm 0.5mm(0.2) 6.8mm × 6.8mm
C-LCC 48 14.22mm × 14.22mm 1.0mm(0.5) 10mm × 10mm
C-DIP 28 35.56mm × 15.5mm 2.54mm 7.8mm × 7.8mm
C-PGA 100/144/208 Customised